Description
Insulated Metal Substrate (IMS), based aluminum clad with ED
copper foil on the opposite side. It is designed for the reliable thermal dissipation of circuitry. A proprietarily formulated
reinforced-polymer-ceramic bonding layer with a high thermal
conductivity and dielectric strength allows us to guarantee
thermal endurance.
The substrate ALCUP G NT is a laminate manufactured in large
productions and ideal for large volume with reduced costs.
