Double sided Cu-clad thin laminate composed of thermal
conductive polymeric glass reinforced prepreg used to produce
double sided and multilayer PCB with all type of constructions.
Thin Lam can also bond to a metal heat sink using standard
multilayer lamination processes with one piece of B-stage COBRITHERM Bond-sheet. Its high resistance to thermal shocks
added to its high thermal conductivity assures reliable and
effective heat dissipation in critical power circuitry.
Its high Tg and Low CTE is excellent to achieve reliable interconnects in between layers after thermal cycles.