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Free Datasheet

BOND SHEET CURED + THERMAL TAPE + AIR GAP FILLER

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Description

• Ultra-thin dielectric layer, high dielectric strength, high thermal conductivity and low thermal resistance.
• Consisting of a glass fabric base, enriched with mineral fillers.
• Thermal conductivity BSC 2.2 W/mK with dielectric strengths greater than 4 KV (70 µm dielectric) or 6 KV (100 µm dielectric ).
• Low thermal resistance which efficiently dissipates the heat generated by the power components to the cooling elements.
• Silicon free.
• Ideal for pick and place automation
• Side A with self-adhesive pressure sensitive adhesive tape TT50 with excellent wettability and conformability to aluminum ,copper and FR4 surfaces.
• Side B with Aismalibar Thermal air gap filler, a unique technology that provides air gap filling capacity when TIM arrives to 35-40ºC

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