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BOND SHEET CURED HTG + AIR GAP FILLER
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Description
Ultra-thin dielectric layer, high dielectric strength, high thermal conductivity and low thermal resistance.
Consisting of a glass fabric base, enriched with mineral fillers.
Thermal conductivity BSC 3.2 W/mK with dielectric strengths greater than 4 KV (70 µm dielectric) .
Low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements.
Silicon free.
Ideal for pick and place automation.
One or two sides with Aismalibar Thermal air gap filler, a unique technology that provides air gap filling capacity when TIM arrives to 35-40ºC.
Low mounting pressure.
No need of thermal grease.
Offered in cut two size.
Dry surface , non-tacky.
No need to peel a liner.
Ideal for pick and place automation.
Very low CTE expansion.
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