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Free Datasheet

BOND SHEET CURED HTG + AIR GAP FILLER

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Description

  • Ultra-thin dielectric layer, high dielectric strength, high thermal conductivity and low thermal resistance.
  • Consisting of a glass fabric base, enriched with mineral fillers.
  • Thermal conductivity BSC 3.2 W/mK with dielectric strengths greater than 4 KV (70 µm dielectric) .
  • Low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements.
  • Silicon free.
  • Ideal for pick and place automation.
  • One or two sides with Aismalibar Thermal air gap filler, a unique technology that provides air gap filling capacity when TIM arrives to 35-40ºC.
  • Low mounting pressure.
  • No need of thermal grease.
  • Offered in cut two size.
  • Dry surface , non-tacky.
  • No need to peel a liner.
  • Ideal for pick and place automation.
  • Very low CTE expansion.
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