BOND SHEET CURED HTG +THERMAL TAPE + AIR GAP FILLER
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Description
Ultra-thin dielectric layer, high dielectric strength, high thermal conductivity and low thermal resistance.
Consisting of a glass fabric base, enriched with mineral fillers.
Thermal conductivity BSC 3.2 W/mK with dielectric strengths greater than 4 KV (80 µm dielectric).
Low thermal resistance which efficiently dissipates the heat generated by the power components to the cooling elements.
Silicon free.
Side A with self-adhesive pressure sensitive adhesive tape TT50 with excellent wettability and conformability to aluminum ,copper and FR4 surfaces.
Side B with Aismalibar Thermal air gap filler, a unique technology that provides air gap filling capacity when TIM arrives to 35-40ºC• Low mounting pressure.