Description
• Hight Tg Ultra-thin dielectric layer, high dielectric strength, high thermal conductivity and low thermal resistance.
• Consisting of a glass fabric base, enriched with mineral fillers.
• Thermal conductivity of 3.2 W/mK with dielectric strengths greater than 4 KV (80 µm dielectric)
• Low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements.
• Silicon free.
• One side or 2 sides of self-adhesive pressure sensitive adhesive tape TT50 with excellent wettability and conformability to aluminum ,copper and FR4 surfaces.
• Very Low CTE expansion
