Description
• Ultra-thin dielectric layer, high dielectric strength, high thermal conductivity and low thermal resistance.
• Consisting of a glass fabric base, enriched with mineral fillers.
• Thermal conductivity of 2.2 W/mK with dielectric strengths greater than 4 KV (70 µm dielectric) or 6 KV (100 µm dielectric thickness).
• Low thermal resistance Rth of 0.315 (70µm), or 0.45 Kcm2/W (100µm), which efficiently dissipates the heat generated by the power components to the cooling elements.
• Silicon free.
• Ideal for pick and place automation
• One side or 2 sides of self-adhesive pressure sensitive adhesive tape TT50 with excellent wettability and conformability to aluminum ,copper and FR4 surfaces.
