Insulated Metal Substrate (IMS), based aluminum clad with ED
copper foil on the opposite side. It is designed for the reliable
thermal dissipation of circuitry. Its 150 micron dielectric layer
is ideal for extreally high voltage electronics when there is
also a need of thermal dissipation. A proprietarily formulated
reinforced-polymer-ceramic bonding layer with a high thermal
conductivity of 2.2W/mºK and high dielectric strength allows us
to guarantee thermal endurance.
The entire COBRITHERM range is 100% proof test guaranteed.
AISMALIBAR tests the isolation in between the copper and
aluminum layers under high voltage.
Ideal for power moduls, IGBTS and automotive power train.