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COBRITHERM HTC 2,2W (90µm–130µm)

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Insulated Metal Substrate (IMS), based aluminium clad with ED copper foil on the opposite side. It is designed for the reliable thermal dissipation of circuitry. A proprietarily formulated reinforced-polymer-ceramic bonding layer with a high thermal conductivity of 2.2W/mºK and high dielectric strength allows us to guarantee thermal endurance. The entire COBRITHERM range is 100% proof test guaranteed. AISMALIBAR tests the isolation in between the copper and aluminium layers under high voltage. Ideal for power modules, IGBTS and automotive power train.