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FASTHERM Cu-Cu (25µm-35µm)

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Insulated Metal Substrate (IMS), based copper clad with RA
copper foil on one side. It is designed for a reliable thermal
dissipation of circuitry.
FASTHERM Cu-Cu is ideal for pedestrian copper grow on pcbs.
Due to its special dielectric layer Fastherm can be used for
conformable MPCB manufacturing.
It can be bent after MPCB production while maintaining the
initial dielectric strength in between conductive layers.