Insulated Metal Substrate (IMS), based aluminum clad with ED
copper foil on the opposite side. It is designed for the reliable thermal dissipation of circuitry. A proprietarily formulated
reinforced-polymer-ceramic bonding layer with a high thermal
conductivity of 3.2W/mºK and high dielectric strength allows us
to guarantee thermal dissipation from electronic components
to the aluminum base in fast and efficient way. High MOT values guaranty the reliability of the laminate.
The entire COBRITHERM range is 100% proof test guaranteed.
AISMALIBAR tests the isolation in between the copper and
aluminum layers under high voltage.
Ideal for power moduls, IGBTS and automotive power train.