Insulated Metal Substrate (IMS), based copper clad with ED
copper foil on the opposite side. It is designed for the reliable
thermal dissipation of circuitry. The usage of copper base will
reduce the mismatch in between the functional copper layer
and the base material. Its 130 micron dielectric layer is ideal
for externally high voltage electronics when there is also a
need of thermal dissipation. A proprietarily formulated reinforced-polymer-ceramic bonding layer with a high thermal
conductivity of 2.2W/mºK and high dielectric strength allows us
to guarantee thermal endurance.
The entire COBRITHERM range is 100% proof test guaranteed.
AISMALIBAR tests the isolation in between the copper and
aluminum layers under high voltage.