Dielectric polymerized glass reinforced in a bond sheet with
high thermal conductivity. It is based on epoxy ceramic chemistry, and intended for improving thermal contact between two
surfaces. Its high dielectric resistance added to its high thermal
conductivity assures heat dissipation in critical power circuitry
assuring high dielectric strength. Ideal for thermal insulating
material, adhesive less, easy to assemble on PCBA and excellent dielectric performance.