High Tg - B-stage dielectric prepreg glass reinforced with high
thermal conductivity. It is based on epoxy ceramic chemistry,
and intended for effective bonding between multilayer circuits
(PCB) and metal heat spreaders. Its high dielectric strength and
resistance to thermal shocks added to its high thermal conductivity assures effective heat dissipation in critical power circuitry. Its low CTE value is ideal to achieve excellent interconnect
reliability over thermal cycles.