Description
Insulated Metal Substrate (IMS), based in low CTE aluminium
clad with a low tensile modulus dielectric layer to an ED copper
foil.
The Ultrathin LM has been designed to reduce thermal heat
from MPCBs and at the same time improve the behaviour over
thermal cycle test. The reduction of the tensile modulus of the
Ultrathin LM will significantly reduce the cracking of solder
joints. The dielectric layer composition has been develop to
minimize the internal stress during thermal cycling. The typical
mismatch between aluminium base and copper is adjusted and
reduced thanks to the low modulus behaviour of the dielectric
layer. A proprietarily formulated polymer-ceramic bonding layer
with high thermal conductivity and dielectric strength allow us
to guarantee thermal endurance.
