Description
Double sided Cu-clad thin laminate composed of thermal
conductive polymeric glass reinforced prepreg used to produce
double sided and multilayer PCB. Thin Lam bonds to a metal
heat sink using standard multilayer lamination processes with
one piece of B-stage COBRITHERM Bond-sheet. Its high resistance to thermal shocks added to its high thermal conductivity
assures reliable and effective heat dissipation in critical power
circuitry
