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Thermal Multi-layer

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AISMALIBAR’s COBRITHERM THIN LAM is a thin copper laminate designed for thermal dissipation on PCBs. It can be used for any multilayer construction with standard multilayer process.

THIN LAM is a double side Cu-clad thin laminate built on the basis of thermal conductive polymeric-ceramic filed resin with glass reinforcement, the ideal replacement for standard FR4 when thermal release is required.