Description
Aismalibar’s thermal interface materials have been designed to overcome the main problems that we find working with Thermal Pastes and Dielectric Thin Films.
A clean, fast and efficient thermal interface material used to solve interface in between MPCB / Power Components and heat sinks, improving dielectric isolation and fast thermal transmission.
• Air voids reduction
• Low thermal resistance
• Silicon free no need thermal paste or grease
• TIM Surface tack free for easy assembly
• No need to peel a liner with Aismalibar Air Gap Filler technology
