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Thermal Interface Material

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Aismalibar’s thermal interface materials have been designed to overcome the main problems that we find working with Thermal Pastes and Dielectric Thin Films.

A clean, fast and efficient thermal interface material used to solve interface in between MPCB / Power Components and heat sinks, improving dielectric isolation and fast thermal transmission.

• Air voids reduction
• Low thermal resistance
• Silicon free no need thermal paste or grease
• TIM Surface tack free for easy assembly
• No need to peel a liner with Aismalibar Air Gap Filler technology